Maintain High Efficiency and Power Factor Across the Load Range, yet
Consume Just 60 mW at No-Load
SHANGHAI--(BUSINESS WIRE)--
Power Integrations (Nasdaq:POWI),
the leader in high-voltage integrated circuits for energy-efficient
power conversion, today announced its HiperPFS™-3
family of power factor correction ICs, which offer high power factor and
high efficiency across the entire load range. Targeting applications
with continuous power demands up to 405 W for universal input and 900 W
for high-line, the ICs feature efficiency levels of better than 95% from
10% load to full load and consume less than 60 mW under no-load
conditions. A power factor of above 0.92 is easily achievable at 20%
load.
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The highly integrated HiperPFS-3
devices include the variable frequency CCM controller, high-voltage
power MOSFET and a Qspeed™ low QRR boost diode. The new devices also
employ an innovative means of controlling EMI without adversely
affecting power factor at light loads. Poor system power factor at light
load is caused by X capacitors that are used to reduce differential mode
EMI being fed back to the AC line. HiperPFS-3
ICs incorporate a digital power factor-enhancing circuit that activates
during light load conditions; this increases the compensation to
overcome the reactance of X capacitors in the EMI filter, minimizing the
phase angle difference between the input voltage and the current.
Consequently, designers may increase the size of the X capacitors while
minimizing or eliminating differential-mode chokes, thereby reducing EMI
without degrading light load power factor performance. This results in a
smaller, lower cost, EMI filter stage.
Comments Edward Ong, product marketing manager at Power Integrations:
“Standby energy-use standards such as ErP Lot 6 have previously forced
designers of PCs and other systems to include both a main PSU and
standby power supply. The excellent light load efficiency of our new HiperPFS-3
ICs enables them to eliminate the standby power supply, saving
components, design time, space and cost.”
Available for both high and low-line applications, HiperPFS-3
ICs cover a continuous output power up to 900 W. Thermally efficient
eSIP-16 packaging simplifies heat sink mounting. Devices cost $1.27 in
10,000 piece quantities. For more information please visit http://www.power.com/products/hiperpfs-3.
About Power Integrations
Power
Integrations, Inc. is a leading innovator in semiconductor
technologies for high-voltage power conversion. The company’s products
are key building blocks in the clean-power ecosystem, enabling the
generation of renewable energy as well as the efficient transmission and
consumption of power in applications ranging from milliwatts to
megawatts. For more information please visit http://www.power.com.
Power Integrations, HiperPFS and the Power Integrations logo are
trademarks or registered trademarks of Power Integrations, Inc. All
other trademarks are the property of their respective owners.

View source version on businesswire.com: http://www.businesswire.com/news/home/20150623006699/en/
Source: Power Integrations, Inc.